Generative AI opens a new era of smart computing, and big models and AIGC applications drive high growth in arithmetic demand.

From server to edge, to AI mobile phones, AI PCs, AIoT, and smart cars, AI chip players in various fields are facing new opportunities and challenges.

The combination of AI big models and various tracks has brought new experience innovations, and the landing of these new experiences cannot be separated from the support of various AI chips. Looking around the world, the fierce changes in the industry pattern have also allowed more Chinese AI chip companies to see new development opportunities.

At the same time, the complexity of chip design continues to rise, the requirements for rapid mass production and market launch of products continue to increase, emerging application markets continue to emerge, and the pressure of investment and cost has also risen.

As the ‘cornerstone’ of AI industry development, AI chip is the core force for realising AI industrialisation and landing, and plays a decisive role in the progress of AI technology and industry application.

Nowadays, all kinds of AI chip enterprises can be said to be a hundred competitors, and the main tone of the domestic AI chip industry has become a group of heroes competing for the stakes. In such an industrial context, we gather the world's top experts in the field of AI chip production, academia, research and application, as well as investment and financing, to provide them with a platform for the exchange of ideas and the collision of views.

On 6-7 September, the Global AI Chip Summit 2024 (GACS 2024) will be held at Liaoning Building in Beijing. The Global AI Chip Summit has been successfully held for six times so far, and has now become one of the largest, highest specification and most influential industry summits in China.

This year's summit is co-hosted by CoreStuff and SmartGorilla, with the theme of ‘The Era of Smart Computing and the Road of Core Construction’. The summit adopts a new format of ‘main conference + technology forum + exhibition’. The main conference consists of an opening ceremony and three special sessions on data centre AI chips, AI chip architecture innovation, and edge/end-side AI chips, which will be held at the main venue; the technical forum is divided into Chiplet Key Technology Forum (fee-based), Smart Computing Clusters Technology Forum (fee-based), and China RISC-V Computing Chip Innovation Forum, which will be held in the sub-venues.

After two months of intensive preparation, the summit has invited 50+ guests from the fields of AI chips, Chiplet, RISC-V, Smart Computing Clusters and AI Infra System Software, etc., who will present keynote reports, keynote speeches, high-end dialogues, and roundtable panels, etc. The full lineup of guests and the final agenda will be unveiled next.

In terms of exhibition, 11 exhibitors will showcase their technologies, products and solutions during the summit, namely HP, DriveNets, Liko, Alphawave, Qianzhan Technology, Zhonghao Xinying, Chaomo Technology, Wisdom Warehouse Storage, Houmao Intelligence, Yicasting Technology, and Appleseed Technology. Meanwhile, the two AIIP AI Productivity Innovation Pioneers lists will also be unveiled on the morning of the second day of the summit.

The official website of the conference is now fully online, you can search this link: https://gacs.zhidx.com/2024/ for more information about the conference.